P1 等离子PCB清洁机
等离子体清洗机的原理是通过高频电场或微波发生器产生强电场,使气体分子电离,形成等离子体。当高能电子与气体分子发生碰撞时,会引起化学反应,产生氧离子、氮离子等一系
等离子体清洗机的原理是通过高频电场或微波发生器产生强电场,使气体分子电离,形成等离子体。当高能电子与气体分子发生碰撞时,会引起化学反应,产生氧离子、氮离子等一系列活性离子和自由基。这类活性离子和自由基具有很强的化学活性,在接触物体表面时,会与污染物发生反应,将其分解或转化为无害物质,从而达到清洁效果。
The principle of plasma cleaning machine is to generate a strong electric field through high-frequency electric field or microwave generator, which ionizes gas molecules and forms plasma. When high-energy electrons collide with gas molecules, a chemical reaction occurs, producing a series of active ions and free radicals such as oxygen ions and nitrogen ions. These types of active ions and free radicals have strong chemical activity. When they come into contact with the surface of an object, they react with pollutants,decomposing or converting them into harmless substances, thereby achieving a cleaning effect.
产品特点 Product Feature
·基于PC的工业控制加C++运动控制系统,实现可视化及离线编程等;
·可扩展各种功能(MES、加温、扫码、视觉、测高等功能);
·采用6轴+松下私服控制实现高速高精度全自动化作业;
·整体焊接机架工艺设计(专利)保证设备高精度及一致性;
·可选配:松下私服/汇川私服/步进等离子电源(模拟、数字);
·可选配:松下私服/汇川私服/步进等离子电源(模拟、数字);
·PC based industrial control with C++motion control system, realizing visualization and offline programming, etc
·Scalable with various functions (MES, heating, scanning,vision, measurement, etc.)
·Using 6-axis and Panasonic private server control to achieve high-speed, high-precision, and fully automated operations
·The overall welding frame process design (patent) ensures high precision and consistency of the equipment
·Optional: Panasonic Private Server/Huichuan Private Server/Stepper Plasma Power Supply (Analog, Digital)
·Optional: Panasonic Private Server/Huichuan Private Server/Stepper Plasma Power Supply (Analog, Digital)
技术参数 Technical Parameters
项目名称 (Item) | 技术规格(Specification) |
设备型号 (Model) | P1 |
设备尺寸(长x宽x高) (Size(L*W*H)) | L1100*D700*H1800 |
设备重量(Weight) | About 1550KG |
设备电源(Power supply) | AC220V 1 0A 50/ 60HZ |
设备气源(Air) | 0.6MPa |
轴 数(Cold storage quantity) | 6轴可控 X、Y、轨道 |
控制方式(Rebound quantity/loading quantity) | PC工控+伺服闭环电机 |
最大移动速度 (Temperature return range) | 500mm/s |
定位精度 ( Cold storage temperature range) | ±0.1 mm |
重复精度 (Grasp Accurac y) | ±0.05mm |
工作范围(Mixing method) | L500*W350*H1 00 |
元件最大高度 (Solder paste grasping method) | 输送面上 80 下 30mm以产品实物为准 |
调幅速度 (operating mode) | 250mm/min |
输送高度(Working noise) | 900±20mm |
输送速度 (Control system) | 2-5m/min |
传送类型 (Rated power) | 防静电皮带(选配) |
传送方向 (Maximum power) | L → R (R → L 选配) |
边缘空间 (Security system) | ≥ 3mm |
最大负载 (Packing method) | 4kg/m 均匀分布 |
等离子电源 (Packing method) | 数字电源(选配) |